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Precision Assembly

       IPI provides customers with various precision assembly technical solutions, significantly improving the precision and efficiency of the assembly process through automatic loading, sorting and classification, automatic assembly, and assembly effect inspection.

Automatic Welding Equipment

Application:
Used for the welding of precision electronic components.

Advantages:
Ⅰ.    Dual-station layout with parallel loading/unloading and welding, improving production efficiency.
Ⅱ.    Machine vision guidance, combined with a customized rotating module, achieves precise multi-sided welding.
Ⅲ.    Functional and versatile design allows for rapid equipment changeovers by replacing product fixtures.
Ⅳ.    High-precision temperature control and cleaning system ensure accurate control of welding temperature and high-quality welding.
Ⅴ.    Real-time analysis of production status and equipment operating conditions, achieving product traceability and equipment reliability.

Automatic Labeling Equipment

Application:
Used for the attachment of auxiliary materials to circuit boards.

Advantages:
Ⅰ.    Machine vision-guided high-precision attachment, with fly-shooting technology reducing start-stop waiting times.
Ⅱ.    Quick-change supply modules for flexible application scenarios.
Ⅲ.    Functional and versatile design allows for rapid equipment changeovers by replacing product fixtures.

Automatic Glue Dispensing Equipment

Application:
Used for dispensing and fixing components in electronic products.

Advantages:
Ⅰ.    The channel width is adjustable, accommodating different carriers.
Ⅱ.    Uses vision guidance for precise dispensing.

Automatic Film Attachment Equipment

Application:
Used for the attachment of process films in electronic product manufacturing.

Advantages:
Ⅰ.    Fully automatic loading and unloading, with inline operation and uninterrupted material changeovers.
Ⅱ.    High-precision attachment with efficient multi-head parallel operation.
Ⅲ.    Automatic film feeding, attachment, and pressurization, compatible with both roll and sheet materials.
Ⅳ.    Self-inspection after attachment, sorting OK/NG materials.
Ⅴ.    Digital system for full-process tracking of OEE, images, and pressure data.

Automatic Film Removal Equipment

Application:
Used for removing process films from electronic products.

Advantages:
Ⅰ.    Fully automatically completes loading, pressurization, film removal, inspection, and unloading, achieving full process automation.
Ⅱ.    Automatic scanning, with automatic recording and uploading of full process data and images to a server for product traceability.
Ⅲ.    Automatic re-inspection and sorting of OK/NG materials.
Ⅳ.    Whole-line OEE system management for lean production.

Automatic Screw Locking Equipment

Application:
Used for locking micro-screws in electronic products.

Advantages:
Ⅰ.    Suitable for micro and special-shaped screws.
Ⅱ.    High-precision vision inspection for automatic screw hole positioning.
Ⅲ.    Automatic torque curve monitoring, with precise post-tightening inspection to ensure locking yield.
Ⅳ.    Laser scanning monitors the height data after locking and assembly, preventing defective products from escaping.
Ⅴ.    Digital system for full-process tracing of images, torque, and yield data.